There was an article in SlashDot not too long ago (sorry, don't have the reference) about IBM being about to use metal vias (essentially, vertical wiring) for building what are basically 3D chips. This will allow memory to be much closer to the processor, for a given amount of memory. There will, of course, be heat dissipation problems galore.
Copyright © 2017, Eklektix, Inc.
Comments and public postings are copyrighted by their creators.
Linux is a registered trademark of Linus Torvalds