OpenHSF Initiative to Present at VR World Congress; Industry-Wide Effort
Invited to Debate Standards at Virtual Reality Forum in Paris
OpenHSF Initiative to Present at VR World
Industry-Wide Effort Invited to Debate Standards at Virtual Reality Forum in
Oakland, CA September 6, 2002 The OpenHSF Initiative announced today
that they will be making their first European appearance at the VR World
Congress V in Paris in September. The VR World Congress V provides the forum
for the identification of prospective partners to propose projects for
support by the European Commission under the Sixth Framework program as well
as a platform for sharing experience and innovation.
The OpenHSF Initiative (www.openhsf.org) was launched by leading 3D
component suppliers, Tech Soft America (TSA) and Spatial, to establish an
open, common visualization format, for the efficient exchange of rich 2D/3D
data between disparate applications. Having recently developed strong
support and users in Asia, the OpenHSF Initiative hopes to build a stronger
relationship with industry vendors in Europe to establish even greater
involvement in the promotion of this powerful, ubiquitous standard.
Roger Frampton of the VR World Congress stated, We were very enthusiastic
when we first heard of the OpenHSF Initiative and continue to be impressed
by their momentum in North America, Europe and ASIA .. The VR World Congress
is geared toward discovering the next generation of VR/i3D applications and
what technologies and techniques will be required to deliver them andthe
OpenHSF Initiative is one of those technologies that will be working in the
next generation of applications. As such we are eager to have an OpenHSF
representative on our panel
Added Yanick Fluhmann, Co-Founder of TSA, The OpenHSF membership includes
industry leaders such as Dassault Systemes, PTC, SolidWorks, Alias |
Wavefront, ANSYS, Daimler Chrysler and others. All of these companies are
committed to the establishment of a rich, common format for CAD. The VR
World Congress is an excellent opportunity for 3D users and developers to
learn more about the the initiative and how it will impact their use of 3D.
Details of Debate:
Date: September 9th, 2002
Location: Centre Chaillot-Galliera, Avenue George V, Paris, France
Moderator: Eric Badique, European Commission, Luxembourg
Yanick Fluhmann, Tech Soft America, co-sponsor of the OpenHSF Initiative for
Anders Jepsen, Web 3D Consortium
About the OpenHSF Initiative
The OpenHSF Initiative supplies the complete solution for engineering
visualization interoperability. It is an industry-wide effort to establish a
common, open and robust format for sharing visualization data between users
of disparate engineering applications through the publishing of the HOOPS
Stream Format (HSF) specification. With the publication of the OpenHSF
Specification document, the entire industry now has complete access to the
robust HOOPS Stream Format (HSF), which allows for the intelligent,
stream-capable sharing of visualization data between disparate engineering
applications. The OpenHSF Advisory Council has been established to ensure
the OpenHSF Specification continues to address the needs of the OpenHSF
community and remains open and available to all interested parties. To find
out more about the powerful HSF format, the OpenHSF Initiative and view
sample streaming files, visit www.openhsf.org.
About Tech Soft America
Tech Soft America (TSA) provides premier customer driven development tools,
consulting and support services enabling its partners to rapidly deliver
world-class technical software. TSA develops the HOOPS 3D Application
Framework, HOOPS Stream Toolkit and HOOPS Net Server, all components
designed to dramatically simplify the design, development and maintenance of
high-performance, interactive 2D and 3D applications built for PCs, UNIX
workstations, Linux and the Web.
HOOPS technology has been incorporated into over 125 commercial software
applications, from such leaders as PTC, EDS, SolidWorks, Fluent, Tecoplan,
Mechanical Dynamics, SPSS, and Minitab.
The company maintains corporate headquarters in Oakland, California and can
be reached at http://www.hoops3d.com.
HOOPS is a registered trademark of Tech Soft. Other brand and product names
are trademarks of their respective owners.
Tech Soft America Press Contact:
Spatial Corp., a Dassault Systèmes S.A. (Nasdaq: DASTY, Euronext Paris #
13065, DSY.PA,) company is a market-leading provider of world-class 3D
software development technologies. Spatial develops, markets, and supports
best-of-breed 3D development technologies and services, to address the
exponential requirements of 3D in Business-to-Business (B2B) applications.
Spatials component products for 3D modeling, visualization, and
interoperability have been adopted by some of the world's most recognized
software developers, manufacturers, research institutes, and universities.
In addition, by offering CAA V5, the Component Application Architecture used
by Dassault Systemes, Spatial is the market-leading provider of 3D
development technologies. Headquartered in Westminster, Colorado, Spatial
has offices in the USA, Germany, France, Japan, and the United Kingdom. For
more information, please visit Spatials Web site at www.spatial.com or
contact Spatial by email at firstname.lastname@example.org or by phone at 303-544-2900 or
Spatial Press Contact: