Small correction-already in the works...
Posted Oct 2, 2007 0:20 UTC (Tue) by vomlehn
In reply to: Small correction
Parent article: Memory part 2: CPU caches
There was an article in SlashDot not too long ago (sorry, don't have the reference) about IBM being about to use metal vias (essentially, vertical wiring) for building what are basically 3D chips. This will allow memory to be much closer to the processor, for a given amount of memory. There will, of course, be heat dissipation problems galore.
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